Research Progress of Thermal Conductive Polymer Composites

Abstract With the rapid development of electronic information technology, the heat dissipation of electronic devices is facing severe challenges. It’s urgent to develop high-performance thermal conductive composites. Polymer composites have been widely used in the thermal conductive materials, due to its light weight, high strength and excellent flexibility. In this paper, the mechanisms of thermal conduction of polymer composites, thermal conductive fillers and influential factors of thermal conductivity were introduced. The research progress of improving the thermal conductive polymer composites by surface functionalization, hybrid particles, filler orientation and 3D interconnected structure was also summarized. The current problems in thermal conductive composites were summarized. Besides, the development direction of the thermal polymer composites in the future were prospected.

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	Zhao Jingqi
	Meng Fancheng
	Shen Jingbo
	Feng Yakai

Keywords： thermal conduction； polymer composites； fillers

Received 2019-05-05;

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Zhao Jingqi, Meng Fancheng, Shen Jingbo, Feng Yakai.Research Progress of Thermal Conductive Polymer Composites[J] Chemcial Industry and Engineering, 2020,V37(3): 67-73

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