Research on Remove of Impurity of SOG-polycrystalline Silicon Cutting Loss Waste by Acid Pickling

化学工业与工程

Chemcial Industry and Engineering

2021, Vol. 38

Issue (1) :79-85 DOI: 10.13353/j.issn.1004.9533.20200345

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Research on Remove of Impurity of SOG-polycrystalline Silicon Cutting Loss Waste by Acid Pickling

Li Feng^1,2, Liu Yang³, Guo Jing⁴, Xing Pengfei²

1. Shangluo University, Shaanxi Key Laboratory of Comprehensive Utilization of Tailings Resources, Shaanxi Shangluo 726000, China;
2. School of Metallurgy, Northeastern University, Shenyang 110819, China;
3. School of Resources and Environmental Engineering, East China University of Science and Technology, Shanghai 200237, China;
4. School of Materials and Metallurgy, University of Science and Technology, Liaoning Anshan 114051, China

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Abstract In order to obtain a kind of high-purity raw material for the preparation of high-purity silicon, the methods to purify the cutting loss waste(CLW), such as acid leaching, ultrasonic field purification were studied on the basis of analyzing the physical properties of CLW. The effect of mass fraction of hydrochloric, acid leaching time, temperature, ratio of leaching liquid to solid and stirring speed on impurity remove was investigated, and the kinetics of ultrasonic pickling process was analyzed. The optimal conditions of acid leaching were obtained as follows: hydrochloric acid 19%(mass fraction), reaction time 3 h, temperature 60 ℃, the ratio of leaching liquid to solid 4∶1 and stirring speed 150 r/min. With this optimum condition, up to 96.50% metallic in CLW can be removed, 46.44% non-metallic can be removed. The removal effect of ultrasonic leaching was better than that of mechanical stirring leaching. However, with the extension of leaching time, the removal effect did not change significantly. As a result, the elimination of metallic and non-metallic impurities reached 98.43% and 52.40% respectively. The reaction process of ultrasonic pickling CLW conforms to the nuclear shrinkage model, and the reaction process is product layer diffusion control.

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	Li Feng
	Liu Yang
	Guo Jing
	Xing Pengfei

Keywords： SOG-polycrystalline silicon； cutting loss waste(CLW)； acid pickling； ultrasonic field； kinetics

Received 2020-07-13;

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Li Feng, Liu Yang, Guo Jing, Xing Pengfei.Research on Remove of Impurity of SOG-polycrystalline Silicon Cutting Loss Waste by Acid Pickling[J] Chemcial Industry and Engineering, 2021,V38(1): 79-85

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