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Current Issue
1989 Vol.6 Issue.3,
Published 1989-07-15
Article
Article
1
Torsional Braid Analysis on the Cure Process of Epoxy Resin/PA—203/DMP—30
Li Feng-Ying, Lü Jun-Huai, He. Guo-Chao, Wei Zhao-Bo
The heat curing behaviour of epoxy resin/low molecular weight polyamide/2, 4,6-tri(dimethylamino methyl)phenol system has been studied by using to rsional braid analysis technique(TBA), DSC and IR. The reaction mechanism of curing has been discussed.
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1989 Vol. 6 (3): 6-11 [
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1989 Vol. 6 (3): 35-38 [
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1989 Vol. 6 (3): 38-38 [
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1989 Vol. 6 (3): 39-41 [
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1989 Vol. 6 (3): 42-50 [
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1989 Vol. 6 (3): 51-54 [
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1989 Vol. 6 (3): 55-61 [
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