Torsional Braid Analysis on the Cure Process of Epoxy Resin/PA��203/DMP��30

化学工业与工程

Chemcial Industry and Engineering

1989, Vol. 6

Issue (3) :1-5 DOI:

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Torsional Braid Analysis on the Cure Process of Epoxy Resin/PA��203/DMP��30

Li Feng-Ying, L�� Jun-Huai, He. Guo-Chao, Wei Zhao-Bo

(Department of Materiei Science, and Engineering Tianjin vniversity) Xuan Zhen-Ai (Nan Kai University

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Abstract The heat curing behaviour of epoxy resin/low molecular weight polyamide/2, 4,6-tri(dimethylamino methyl)phenol system has been studied by using to rsional braid analysis technique(TBA), DSC and IR. The reaction mechanism of curing has been discussed.

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Received 1989-07-15; published 1989-07-15

Cite this article:

Li Feng-Ying, L�� Jun-Huai, He. Guo-Chao, Wei Zhao-Bo.Torsional Braid Analysis on the Cure Process of Epoxy Resin/PA��203/DMP��30[J] Chemcial Industry and Engineering, 1989,V6(3): 1-5