Preparation Method for Ni-P Electroless Plating on Tungsten-Based Sealing Materials

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Abstract

Metal-Ceramic sealing is a key technology for the sealing of vacuum electronic devices. In order to improve the sealing performance of alumina ceramics, the first metallization of alumina ceramics is conducted by using the molybdenum-manganese activation method with tungsten-based sealing materials. Furthermore, the second metallization of alumina ceramics is carried out by an electroless plating of Ni-P. To solve the difficulty of the surface activating, a novel method combining grinding and acid etching is proposed for pretreatment of tungsten-based sealing materials. The results show that the Ni-P plating obtained after the pretreatment is smooth and dense. The bonding force between the first metallization coating and second metallization coating is good.

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	Articles by authors
	Xu Qiang
	Meng Haixing
	Lu Xinpeng
	Hu Jingbo

Keywords： metal-ceramic sealing； the second metallization； alumina ceramics； chemical plating； nickel-phosphorus plating

Received 2014-03-26;

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Cite this article:

Xu Qiang, Meng Haixing, Lu Xinpeng, Hu Jingbo.Preparation Method for Ni-P Electroless Plating on Tungsten-Based Sealing Materials[J] Chemcial Industry and Engineering, 2016,V33(3): 45-49

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