[an error occurred while processing this directive]
化学工业与工程
 首页 |  在线投稿 |  期刊介绍 |  编 委 会 |  投稿指南 |  期刊订阅 |  下载中心 |  出版伦理 |  联系我们 |  English
化学工业与工程 2020, Vol. 37 Issue (3) :67-73    DOI: 10.13353/j.issn.1004.9533.20191502
能源与环境化工 最新目录 | 下期目录 | 过刊浏览 | 高级检索 << | >>
导热高分子复合材料的研究进展
赵敬棋1, 孟凡成2, 申景博1, 冯亚凯2,3
1. 天津莱尔德电子材料有限公司, 天津 300457;
2. 天津大学化工学院, 天津 300350;
3. 天津化学化工协同创新中心, 天津 300072
Research Progress of Thermal Conductive Polymer Composites
Zhao Jingqi1, Meng Fancheng2, Shen Jingbo1, Feng Yakai2,3
1. Tianjin Laird Electronic Materials Co., Ltd., Tianjin 300457, China;
2. School of Chemical Engineering and Technology, Tianjin University, Tianjin 300350, China;
3. Collaborative Innovation Center of Chemical Science and Chemical Engineering(Tianjin), Tianjin 300072, China

摘要
参考文献
相关文章
Download: PDF (892KB)   HTML ()   Export: BibTeX or EndNote (RIS)      Supporting Info
摘要 随着电子信息技术的快速发展,电子设备的散热问题面临严峻的挑战,亟须研发高性能导热复合材料。高分子复合材料因其轻质、高强度和良好的柔韧性,在导热材料领域得到了广泛应用。简要介绍了导热高分子复合材料的导热机理、导热填料以及影响导热率的因素。综述了通过表面功能化、杂化粒子、填料取向和构建3D互联骨架结构等方法提高复合材料导热性能的研究现状。总结了导热材料当前面临的问题,并对未来导热高分子复合材料的发展方向进行了展望。
Service
把本文推荐给朋友
加入我的书架
加入引用管理器
Email Alert
RSS
作者相关文章
赵敬棋
孟凡成
申景博
冯亚凯
关键词导热   高分子复合材料   填料     
Abstract: With the rapid development of electronic information technology, the heat dissipation of electronic devices is facing severe challenges. It’s urgent to develop high-performance thermal conductive composites. Polymer composites have been widely used in the thermal conductive materials, due to its light weight, high strength and excellent flexibility. In this paper, the mechanisms of thermal conduction of polymer composites, thermal conductive fillers and influential factors of thermal conductivity were introduced. The research progress of improving the thermal conductive polymer composites by surface functionalization, hybrid particles, filler orientation and 3D interconnected structure was also summarized. The current problems in thermal conductive composites were summarized. Besides, the development direction of the thermal polymer composites in the future were prospected.
Keywordsthermal conduction;   polymer composites;   fillers     
Received 2019-05-05;
Corresponding Authors: 冯亚凯,E-mail:yakaifeng@tju.edu.cn。     Email: yakaifeng@tju.edu.cn
About author: 赵敬棋(1977-),男,博士,研发部主管,现从事导热复合材料的研究。
引用本文:   
赵敬棋, 孟凡成, 申景博, 冯亚凯.导热高分子复合材料的研究进展[J].  化学工业与工程, 2020,37(3): 67-73
Zhao Jingqi, Meng Fancheng, Shen Jingbo, Feng Yakai.Research Progress of Thermal Conductive Polymer Composites[J].  Chemcial Industry and Engineering, 2020,37(3): 67-73
Copyright 2010 by 化学工业与工程