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ժҪ ��Ӧ�õ��(TBA)��,��ϲ�ʾɨ��ȷ�(DSC)��׷�(IR)�о��˫��A�ܻ��֬/�ͷ��Ӿ��/2,4,6-��(��װ��׻�)��ϵ��ȹ̻��Ϊ,��Թ̻��Ӧ��˳��̽�֡�

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Abstract�� The heat curing behaviour of epoxy resin/low molecular weight polyamide/2, 4,6-tri(dimethylamino methyl)phenol system has been studied by using to rsional braid analysis technique(TBA), DSC and IR. The reaction mechanism of curing has been discussed.

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Received 1989-07-15; published 1989-07-15

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��Ӣ;��;�ι��;κ�ײ�;��;.��֬/�ͷ��Ӿ��/DMP-30��ϵ�̻��̵�Ť��о�[J]. ��ѧ��ҵ�빤��, 1989,6(3): 1-5

Li Feng-Ying, L�� Jun-Huai, He. Guo-Chao, Wei Zhao-Bo.Torsional Braid Analysis on the Cure Process of Epoxy Resin/PA��203/DMP��30[J]. Chemcial Industry and Engineering, 1989,6(3): 1-5