钨基密封材料化学镀Ni-P镀层的制备方法

摘要

真空电子器件密封的关键技术就是金属-陶瓷封接。为了提高氧化铝陶瓷的封接性能,通过活化钼-锰法将钨基密封材料涂覆到氧化铝陶瓷表面进行一次金属化,然后采用化学镀Ni-P方法进行二次金属化。针对钨基一次金属化材料表面比较难活化的特点,提出了一种打磨与酸洗相结合的新型预处理方法。实验结果表明,采用打磨后再酸洗的预处理方法所得到的化学镀Ni-P层表面光滑致密,Ni-P镀层与一次金属化基体的结合力良好。

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	徐强
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关键词：金属陶瓷封接；二次金属化；氧化铝陶瓷；化学镀；镍磷镀层

Abstract：

Metal-Ceramic sealing is a key technology for the sealing of vacuum electronic devices. In order to improve the sealing performance of alumina ceramics, the first metallization of alumina ceramics is conducted by using the molybdenum-manganese activation method with tungsten-based sealing materials. Furthermore, the second metallization of alumina ceramics is carried out by an electroless plating of Ni-P. To solve the difficulty of the surface activating, a novel method combining grinding and acid etching is proposed for pretreatment of tungsten-based sealing materials. The results show that the Ni-P plating obtained after the pretreatment is smooth and dense. The bonding force between the first metallization coating and second metallization coating is good.

Keywords： metal-ceramic sealing； the second metallization； alumina ceramics； chemical plating； nickel-phosphorus plating

Received 2014-03-26;

Corresponding Authors: 徐强,E-mail:xuqiang@tju.edu.cn。 Email: xuqiang@tju.edu.cn

About author: 徐强(1967-),男,博士,副教授,现从事电化学方面的研究。

引用本文:

徐强, 孟海星, 卢新鹏, 胡景博.钨基密封材料化学镀Ni-P镀层的制备方法[J]. 化学工业与工程, 2016,33(3): 45-49

Xu Qiang, Meng Haixing, Lu Xinpeng, Hu Jingbo.Preparation Method for Ni-P Electroless Plating on Tungsten-Based Sealing Materials[J]. Chemcial Industry and Engineering, 2016,33(3): 45-49

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