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化学工业与工程
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��ѧ��ҵ�빤�� 1990, Vol. 7 Issue (1/2) :30-34    DOI:
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ͨ���Ի�ѧ��Ni—P�Ͻ���������Լ������輰�����ٶȵIJ���,�ó���������ĵ���1/Rp������ܶ�i�����Թ�ϵ���������������ߵķ���,����ϸ���о��˴������������缫�ϵ��������̡�����˻�ѧ��Ni—P�Ͻ��ǰ��绯ѧ������еġ�
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Study on the Mechanism of Electroless Plating of Ni-P Alloy
Linear relation between 1/Rp and i of the deposition process of Ni-P alloy electroless plating was obtained through the measurements of linear polarization resistance and deposition rate of the process. Oxidation process of hypophosphite on Ni electrode was studied in more detail with anodic polarization curve method. It was proposed that deposition of Ni-P alloy in electroless plating is proceeded according to the electrochemical mechanism.
Department of Applied Chemistry, Tianjin Univesrity

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Abstract�� Linear relation between 1/Rp and i of the deposition process of Ni-P alloy electroless plating was obtained through the measurements of linear polarization resistance and deposition rate of the process. Oxidation process of hypophosphite on Ni electrode was studied in more detail with anodic polarization curve method. It was proposed that deposition of Ni-P alloy in electroless plating is proceeded according to the electrochemical mechanism.
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����ͩ, ������, �����.��ѧ����-�׺Ͻ������о�[J].  ��ѧ��ҵ�빤��, 1990,7(1/2): 30-34
GUO He-Tong, LIU Shu-Lan, WANG Jin-Gen.Study on the Mechanism of Electroless Plating of Ni-P Alloy[J].  Chemcial Industry and Engineering, 1990,7(1/2): 30-34
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